الرئيسية
الأبحاث العلمية
التدريس
التدرج الوظيفى
السيرة الذاتية
البحث الأكاديمى
إتصل بنا
الموقع الجديد
المجالات البحثية
Development of lead free Sn-Ag-Cu solder alloys
Investigation of the creep properties
Investigation of the tensile properties
Investigation of the thermal properties
Studying microstructure using SEM, EDS and XRD
الابحاث العلمية
1 -
Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications (2101).
2 -
Improvement of strength‑ductility trade‑off in a Sn–0.7Cu–0.2Ni lead‑free solder alloys through Al‑microalloying (2020).
3 -
Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring (2019).
4 -
Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications (2019).
5 -
Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead‑free solder alloys with microalloying of Te and Co (2019).
6 -
Impact of permanent magnet stirring on dendrite growth and elastic properties of SneBi alloys revealed by pulse echo overlap method (2018).
7 -
The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring (2017).
8 -
The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring (2017).
9 -
Efect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy (2017).
10 -
Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field (2017).
11 -
Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications (2017).
12 -
Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology (2017).
13 -
Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions (2013).
14 -
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders (2013).
15 -
Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance (2013).
16 -
Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles (2013).
17 -
Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters (2013).
18 -
Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique (2012).
19 -
Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions (2012).
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دخول
2014 all rights reserved.
Zagazig University
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